Taking technology innovation to Bucharest - Payments and IoT hackathon

11 October 2017 - Nick Telford-Reed, Director of Innovation, Worldpay

Building on the hugely successful Worldpay hackathon in London last year, the Worldpay Technology Innovation team has upped-sticks to a new city. Bucharest.

It’s Worldpay’s first Central Eastern European 48-hour hackathon, taking place over the weekend 03-05 November. The hackathon provides an opportunity for technologists to develop the first use cases for mobile to mobile payment using our IoT open-source technology, Worldpay Within. 
 
We’re inviting entrepreneurs, coders, marketers and anyone with an interest in designing proof of concepts with the latest payments software and hardware. We’re also delighted to have partners and co-sponsors, Consult Hyperion and Endava Technology who will be working with the teams to develop their ideas over the weekend. 
 
We chose Bucharest to run our second hackathon because of its thriving engineering community. As a global payments company we have a footprint in 146 countries. It makes sense to run a hackathon where there are great engineers and technologists looking to disrupt the payments market.
 
We will provide access to our new open-source software development kit: a software library with multiple language sockets, which enables the making and receiving of payments between smart devices. An ideation platform will also be available two weeks prior to the hackathon where one-on-one sessions can be booked with technology experts. 
 
I’m really looking forward to seeing the creativity and use cases for payments in IoT.

Register for the event here